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High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

Shenzhen Hansome Technology Co., Ltd.
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    Buy cheap High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair from wholesalers
     
    Buy cheap High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair from wholesalers
    • Buy cheap High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair from wholesalers
    • Buy cheap High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair from wholesalers

    High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

    Ask Lasest Price
    Brand Name : HSTECH
    Model Number : HS-700
    Certification : CE
    Price : Negotiable
    Payment Terms : T/T, Western Union, MoneyGram
    Supply Ability : 100 sets per month
    Delivery Time : 7~9 work days
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    High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair


    5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station


    ​Specification

    Mobile Phone BGA Rework StationModel:HS-700
    Power SupplyAC 100V / 220V±10% 50/60Hz
    Total power2600W
    Heater powerTop heater 1200W(Max), bottom heater 1200W(Max)
    Electric materialDriving motor + smart temp. controller + color touch screen
    Temperature controlhigh precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃)
    Sensor1pcs
    Locating wayV shape PCB support + external universal fixture + laser light for centering and positioning
    Overall dimensionL450mm*W470mm*H670mm
    PCB sizeMax 140mm*160mm Min 5mm*5mm
    BGA sizeMax 50mm*50mm Min 1mm*1mm
    Applicable PCB thickness0.3 - 5mm
    Mounting accuracy±0.01mm
    Weight of machine30KG
    Mount chip weight150g
    Working modesFive: Semi-auto/Manual/Remove/Mount/Weld
    Usage Repairchips / phone motherboard etc

    Features

    1. The upper and lower heating zone, temperature precision control within ±1℃, which can heat up at the same time from the top of he component to the bottom of the PCB; 8 segment temperature control independently.
    2. Hot air district heating for BGA and PCB at the same time, the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.
    3. Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system.
    4. Temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved; temperature can be tested precisely through external measurement interface, curves can be analysed, set and correct on the touch screen at any time.


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