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| Brand Name : | HSTECH | 
| Model Number : | HS-700 | 
| Certification : | CE | 
| Price : | Negotiable | 
| Payment Terms : | T/T, Western Union, MoneyGram | 
| Supply Ability : | 100 sets per month | 
| Delivery Time : | 7~9 work days | 
High Precision K-sensor Control Mobile Phone BGA Rework Station
Specification
| Mobile Phone BGA Rework Station | Model:HS-700 | 
| Power Supply | AC 100V / 220V±10% 50/60Hz | 
| Total power | 2600W | 
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) | 
| Electric material | Driving motor + smart temp. controller + color touch screen | 
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) | 
| Sensor | 1pcs | 
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning | 
| Overall dimension | L450mm*W470mm*H670mm | 
| PCB size | Max 140mm*160mm Min 5mm*5mm | 
| BGA size | Max 50mm*50mm Min 1mm*1mm | 
| Applicable PCB thickness | 0.3 - 5mm | 
| Mounting accuracy | ±0.01mm | 
| Weight of machine | 30KG | 
| Mount chip weight | 150g | 
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld | 
| Usage Repair | chips / phone motherboard etc | 
Features
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
About Packaging



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