30CC PUR Jetting Valve

1. The PUR injection valve comprises several modules: a drum heating module, a pressurized cap module, a nozzle heating module, a flow path module, a valve body module, and a heat dissipation module.

2. The barrel heating module supports the barrel and provides controlled, single-stage heating to initialize the gel's warming process.

3. The pressurized cap module ensures the drum is sealed and pressurized, managing the output pressure via a controller.

4. The heat dissipation module effectively dissipates heat and minimizes noise emanating from the valve body.

5. The piezoelectric injection valve employs a modular design. The section in contact with the gel is configured as the runner module, while the non-contact section is the valve body module.

6. The flow path module can be customized to fulfill dispensing needs across various applications.

7. Nozzle diameters are available in a range from 40µm to 500µm.

8. Nozzles are categorized into three types: flat jet, needle, and extension.

9. Runner modules require regular cleaning in an ultrasonic cleaner. It's crucial to avoid immersing seals in organic solvents. Nozzle cleaning necessitates special tools to prevent damage.

Nozzle and barrel heating

1. Before dispensing, the nozzle must be heated to an appropriate temperature. The heating device utilizes a two-stage heating mode for this purpose.

2. By maintaining a constant temperature at the nozzle, the gel's optimal performance is ensured, allowing the colloid to function at its best.

Specification

Advantages
1.The barrel heating is suitable for 30cc, 100cc, 300cc hot melt adhesive with different volume.
2. Modularized design, easy to replace parts, simple debugging, wide range of process applications.
3. Spray volume can be accurate to 0.3nL, spray adhesive spot consistency accuracy of up to 98%.
4. Minimum 0.17mm line width, minimum 0.15mm spot diameters of hot melt glue spraying process can be realized.
5. Can match any motion platform on the market.

Application Field
SMT/FPC/PCB,Assembly, flat panel display assembly, semiconductor packaging, LED industry, medical equipment industry,Non-marking lingerie industry.

Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional technical team for R&D,but also have a outgoing and experienced marketing team for research and develop, grasps products developing directions, updates the products and technics to meet the continue changing demands. In the past years,we have been always keep innovating and exploing to make cost-efficient products to help our customers saving cost and labor, improving the production efficiency at the same time.
HSTECH set the goal for "High quality and Smart”, that based on the concept of "Quality-Oriented and Customer-orented", and combined the industry feature, smart technology persuit for the smart factory.As for the after-sale service, we insist on "responsibility", we will take reaction at the first when we got quality feedbacks,and service our customers all the time.